Specification

■ Application：Microwave module,Laser,Optical information devices,sensors

■ Bonding Accuracy：±3μm@3sigma

■ Bonding Area：X=60mm,Y=46mm

■ Length of Wire Bonding：≤7mm

■ Loop Height Accuracy：±25.4μm

■ Bond Force：0~360g

■ Spool Diameter：50(2inch)

■ Wire Material：Glod wire(18~50μm)，Cu Wire，Palladiumplating,Copper wire,Alloy wire,Silver wire

■ Bonding Speed：45ms/wire cycle time

■ Optical System：Programmable auto-zoom:2~4 times continuous zoom,1.6~3.6 times is optional

■ Basic OS：Windows

■ Weight：650Kg