■ High-speed, high-precision linear-motor driven 3-axis gantry stage system
■ high-precision dynamic phase-locked loop ultrasonic transducer system
■ Real time deformation monitoring/Real time ultrasonic monitoring
■ Non-destructive pulltest
■ Changing from rear-cut to front-cut conveniently
■ Active cutting method
■ Voice-coil wire clamp
■ Assist camera for bond head maintenance
Specification
■ Application:Power module: automotive components, converter;Lead frame devices: TO power components;Density lead frame: SOIC, HSON;Battery application
■ Bonding Precision:±5μm@3sigma
■ Bonding Area:Max area:305mmx457mm, rotation:±220°
■ Z Axis:50mm Z-stroke; 0.1um resolution
■ Ultrasonic:Frequency: 60KHz; Power:0~65W,support ramp mode
■ Loop Length and Loop Height:Programmable, fixed length and height loop control
■ Device Depth:Max: 35mm
■ Bonding Force:50~1500g; ±3g
■ Capillary Length :2.5/2 inches
■ Bonding Wire Type:Al wire(100~500μm)
■ Bonding Speed:≥1.5 wires/s
■ Operating System:Windows
■ Weight:1.2T
■ High-speed, high-precision linear-motor driven 3-axis gantry stage system
■ high-precision dynamic phase-locked loop ultrasonic transducer system
■ Real time deformation monitoring/Real time ultrasonic monitoring
■ Non-destructive pulltest
■ Changing from rear-cut to front-cut conveniently
■ Active cutting method
■ Voice-coil wire clamp
■ Assist camera for bond head maintenance
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