■ Real time deformation monitoring
■ Real time ultrasonic monitoring
■ Fixed length and height loop control
■ Piezo ultrasonic motor for tail control
■ Support 19mm、25mm capillary(deep access)
■ Assist camera for bond head maintenance
Specification
■ Application:Discrete,Microwave module,Laser,Optical Communication Devices,Sensors,
MEMS, SAW,RF Components, Power Device, etc.
■ Bonding Accuracy:±3μm@3sigma
■ Bonding Area:Max area:305mmx457mm,rotation:0~220°
■ Ultrasonic:0~4W control precision,support ramp mode 1mW resolution
■ Loop Length and Loop Height:Programmable,fixed length and height loop control
■ Device Depth:Max:16mm
■ Bonding Force:0~220g
■ Capillary Length:19mm/25mm
■ Bonding Wire Type:Gold wire(18um~75μm), Al wire(18~75μm)
■ Bonding Speed:≥5wires/s
■ Operating System:Windows
■ Weight:1.2T
■ Real time deformation monitoring
■ Real time ultrasonic monitoring
■ Fixed length and height loop control
■ Piezo ultrasonic motor for tail control
■ Support 19mm、25mm capillary(deep access)
■ Assist camera for bond head maintenance
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