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ZH6000-B

■ Real time deformation monitoring

■ Real time ultrasonic monitoring

■ Fixed length and height loop control

■ Piezo ultrasonic motor for tail control

■ Support 16mm、19mm capillary(deep access)

■ Assist camera for bond head maintenance

■ Large bonding area

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Specification

■ Application:Discrete,Microwave module,Laser,Optical Communication Devices,Sensors, 

                         MEMS, SAW,RF Components, Power Device, etc.

■ Bonding Accuracy:±3μm@3sigma

■ Bonding Area:Max area:305mmx457mm,rotation:0~180

■ Ultrasonic:0~4W control precision,support ramp mode 1mW resolution

■ Loop Length and Loop Height:Programmable,fixed length and height loop control

■ Device Depth:Max:12mm

■ Bonding Force:0~220g

■ Capillary Length:16mm/19mm

■ Bonding Wire Type:Gold wire(18um~75um)

■ Bonding Speed:≥4wires/s

■ Operating System:Windows

■ Weight:1.2T

■ Real time deformation monitoring

■ Real time ultrasonic monitoring

■ Fixed length and height loop control

■ Piezo ultrasonic motor for tail control

■ Support 16mm、19mm capillary(deep access)

■ Assist camera for bond head maintenance

■ Large bonding area

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