Specification

■ Application：Discrete,Microwave module,Laser,Optical information devices,IC,LED

■ Bonding Accuracy：±3μm@3sigma

■ Bonding Area：X=60,Y=70(LFwidth≤80)

■ Lengthof Wire Bonding：≤7mm

■ Min Bond Pad Pitch：45μm

■ Loop Types：Q-Loop,SQ-Loop,BGA-TWS

■ Wire Bonding Capacity：30,000 wires for Step Repeat Matrix

■ Spool Diameter：50(2inch)

■ Wire Material：Glod wire(15~50μm),copper wire,palladium plating copper wire,alloy wire,Silver wire

■ Bonding Speed：45ms/cycle time

■ Optical System：Programmable auto-zoom:2~4 times continuous zoom,1.6~3.6 times is optional

■ Basic OS：Windows

■ Weight：650Kg