■ High precision close loop force control (Accuracy within 1g)
■ High stability of bond point
■ One key switch frequency
■ Drive by electricity without compressed air
■ Unique tailless bumping process and super adaptability for soft substrates
■ Bond head designed by parallelogram support large module of deep access
Specification
■ Application:Discrete, Microwave Module, Laser, Optical Communication Devices, Sensors,
MEMS, SAW, RF Components, Power Device, etc.
■ Bond Wire:Al(18~100μm),Au(15~75μm),Gold Ribbon(12.7x50μm~25.4x300μm),Specific alloy wire
■ Device Depth:Max:21mm
■ Spool:1/2 inch or 2 inch
■ Bond Head Z Range:19mm
■ Bond Head X-Y Range:X=15mm,Y=15mm
■ Lifting Table Z Range:0~19mm
■ Lifting Table X-Y Range:268mm×273mm
■ Bond Power:Numerical control,1000x subdivision
■ Bond Force:0~250g
■ Type of Bonding Tools:25mm/19mm
■ Clamping Table:Maximum Temperature 200℃
■ Weight:About 47kg
■ High precision close loop force control (Accuracy within 1g)
■ High stability of bond point
■ One key switch frequency
■ Drive by electricity without compressed air
■ Unique tailless bumping process and super adaptability for soft substrates
■ Bond head designed by parallelogram support large module of deep access
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